Characteristics of fumed silica and its application in electronic packaging materials

Fumed silica properties

◇ as a liquid thixotropic agent and thickener, anti-settling, anti-sagging;

◇ improving the suspension and dispersibility of pigment fillers in liquid systems;

◇ used as a dispersion and grinding aid;

◇ improve the corrosion resistance of the coating;

◇ improve powder fluidity and storage stability;

◇ Improve powder charge and charge stability;

◇ improve water resistance;

◇ Improve the scratch resistance of the paint film;

◇ Improve color vividness;

◇ fixed special effects;

◇ Improve the physical and mechanical properties of the paint film;

◇ improve the adhesion and flexibility of the paint film;

◇ Improve the viscoelastic properties of rubber and elastomer, and strengthen;

Defoaming effect in defoamer;

◇ improve the surface hardness and scratch resistance of the coating;

Prevent adhesion in ruthenium film and elastomer;

◇ as an adsorbent and carrier;

◇Used for inkjet printing coatings;

advanced as a high-grade filler for dental materials;

As a catalyst carrier, ruthenium has remarkable thermal insulation and is used for low temperature and high temperature insulation.

Application of fumed silica in electronic packaging materials

Organic electroluminescent device (OLED) is a new type of flat display device newly developed. It has low on-drive and low-drive voltage, and can be driven by DC voltage. It can be matched with large-scale integrated circuits, and it is easy to realize full color and brightness. High (>105cd/m2) and other advantages, but the service life of OLED devices can not meet the application requirements. One of the technical difficulties to be solved is the packaging material and packaging technology of the device. At present, foreign countries (Japan, the United States, Europe, etc.) widely use silicone-modified epoxy resin, that is, through the blending, copolymerization or grafting reaction between the two, it can reduce the internal stress of epoxy resin and form molecules. Internal toughening, improve high temperature resistance, and also improve the waterproof, oil and oxygen resistance of silicone, but it requires a longer curing time (a few hours to several days), to accelerate the curing reaction, it needs to be higher Temperature (above 60 ° C to 100 ° C) or increase the amount of curing agent used, which not only increases the cost, but also is difficult to meet the requirements of packaging materials for large-scale device production lines (short-time, room-temperature packaging). By fully dispersing the surface-treated nano-silica in the silicone-modified epoxy resin encapsulant matrix, the curing time of the encapsulant can be greatly shortened (2.0-2.5 h), and the curing temperature can be lowered to room temperature. The sealing performance of the OLED device is significantly improved, and the service life of the OLED device is increased.